Thermal imaging cameras, that have been specifically developed to find faults in electric systems and electromechanical devices, are used for the purpose of even faster and more efficient fault detection. These cameras help our technicians to detect thermal weak points in electronic modules while working in our in-house repair workshop as well as when working at the customer's site.
The compact and flexible InCircuit/function test system can be used to locate faults on digital and hybrid-equipped circuit boards. The function of the individual ICs is tested with test clips. The use of PinPoint diagnostic technology ensures a fast and efficient fault analysis is completed and its excellent fault detection rate means that it is particularly reliably for intense testing phases and sporadic errors.
By using the rework station, it is possible to unsolder ball grid arrays (BGAs) from modules, to reball them or to replace them with new BGAs and resolder them as part of a semi-automated process. The system ensures that all of the neighbouring components are exposed to minimal thermal loads during the unsoldering and soldering process. As the process is semi-automated, it can be repeated with complete accuracy if it has been programmed.
The integrated Dip&Print station ensures that the optimum amount of flux paste is applied to the BGA providing an excellent soldering result and minimal contamination.
The adapter-free and continuous test system is used to quickly find production faults and repair assembled circuit boards. Fault diagnosis is fully automated. An X/Y/Z-controlled testing probe approaches the specified test points at high speed ensuring that open lines, short circuits and component faults can be identified clearly.